Latest trends in ultra-precision polishing/chemical mechanical polishing (CMP) (Part 1) - Development and principle for polishing

Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Tsutomu Yamazaki

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)803-808
Number of pages6
JournalToraibarojisuto/Journal of Japanese Society of Tribologists
Volume55
Issue number11
Publication statusPublished - Dec 1 2010

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Cytidine Monophosphate
Chemical mechanical polishing
abrasives
Silicon
Polishing
polishing
Abrasives
surface roughness
Surface roughness
trends
Glass
glass
silicon

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Latest trends in ultra-precision polishing/chemical mechanical polishing (CMP) (Part 1) - Development and principle for polishing. / Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu; Yamazaki, Tsutomu.

In: Toraibarojisuto/Journal of Japanese Society of Tribologists, Vol. 55, No. 11, 01.12.2010, p. 803-808.

Research output: Contribution to journalArticle

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