Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'

Kazuhiro Nogita, James Kennedy, John Amsler, Matthew Greaves, Cameron Tuesley, Takatoshi Nishimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Solar and electric vehicles offer a sustainable future for the automotive industry and demonstration events offer realistic conditions to test and demonstrate the technology involved. We produced a four wheel solar car "Arrow1" by adopting a variety of appropriate technologies. These include the use of a lead-free solder alloy (Sn-Cu-Ni-Ge) in connections of the electric circuit boards of controllers, terminals of lithium-ion batteries and cable ends for the motor. This paper reports on the team's participation in the largest solar car race, The Bridgestone World Solar Challenge 2013, from Darwin to Adelaide, Australia in mid October 2013.

Original languageEnglish
Title of host publication2014 International Conference on Electronics Packaging, ICEP 2014
PublisherIEEE Computer Society
Pages10-13
Number of pages4
ISBN (Print)9784904090107
DOIs
Publication statusPublished - Jan 1 2014
Event2014 International Conference on Electronics Packaging, ICEP 2014 - Toyama, Japan
Duration: Apr 23 2014Apr 25 2014

Publication series

Name2014 International Conference on Electronics Packaging, ICEP 2014

Other

Other2014 International Conference on Electronics Packaging, ICEP 2014
CountryJapan
CityToyama
Period4/23/144/25/14

Fingerprint

Electric vehicles
Racing automobiles
Automotive industry
Wheels
Cables
Railroad cars
Demonstrations
Controllers
Networks (circuits)
Lead-free solders
Lithium-ion batteries

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

Cite this

Nogita, K., Kennedy, J., Amsler, J., Greaves, M., Tuesley, C., & Nishimura, T. (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. In 2014 International Conference on Electronics Packaging, ICEP 2014 (pp. 10-13). [6826652] (2014 International Conference on Electronics Packaging, ICEP 2014). IEEE Computer Society. https://doi.org/10.1109/ICEP.2014.6826652

Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. / Nogita, Kazuhiro; Kennedy, James; Amsler, John; Greaves, Matthew; Tuesley, Cameron; Nishimura, Takatoshi.

2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, 2014. p. 10-13 6826652 (2014 International Conference on Electronics Packaging, ICEP 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nogita, K, Kennedy, J, Amsler, J, Greaves, M, Tuesley, C & Nishimura, T 2014, Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. in 2014 International Conference on Electronics Packaging, ICEP 2014., 6826652, 2014 International Conference on Electronics Packaging, ICEP 2014, IEEE Computer Society, pp. 10-13, 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 4/23/14. https://doi.org/10.1109/ICEP.2014.6826652
Nogita K, Kennedy J, Amsler J, Greaves M, Tuesley C, Nishimura T. Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. In 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society. 2014. p. 10-13. 6826652. (2014 International Conference on Electronics Packaging, ICEP 2014). https://doi.org/10.1109/ICEP.2014.6826652
Nogita, Kazuhiro ; Kennedy, James ; Amsler, John ; Greaves, Matthew ; Tuesley, Cameron ; Nishimura, Takatoshi. / Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, 2014. pp. 10-13 (2014 International Conference on Electronics Packaging, ICEP 2014).
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