Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding

R. Takigawa, K. Kamimura, K. Nakamoto, T. Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have developed low-temperature bonding and surface micromachining techniques for realizing high quality lithium niobate-on-insulator (LNOI) waveguide device integrated on mature Si platform. This paper reports a fabrication of LNOI ridge waveguides on Si substrates using room-temperature bonding with Si nanoadhesive layer and ultra-precision ductile-mode cutting.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - May 2019
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: May 21 2019May 25 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period5/21/195/25/19

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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