LNOI photonics fabricated on Si wafer by room temperature bonding

Kaname Watanabe, Yuya Yamaguchi, Atsushi Kanno, Ryo Takigawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.

Original languageEnglish
Title of host publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45
Number of pages1
ISBN (Electronic)9781665405676
DOIs
Publication statusPublished - Oct 5 2021
Event7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 - Virtual, Online, Japan
Duration: Oct 5 2021Oct 11 2021

Publication series

Name2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Conference

Conference7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Country/TerritoryJapan
CityVirtual, Online
Period10/5/2110/11/21

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'LNOI photonics fabricated on Si wafer by room temperature bonding'. Together they form a unique fingerprint.

Cite this