Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

Sung Hwa Hwang; Takamasa Okumura; Kunihiro Kamataki; Naho Itagaki; Kazunori Koga; Tatsuyuki Nakatani; Masaharu Shiratani

doi:10.35848/1347-4065/abbb20

Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

Sung Hwa Hwang, Takamasa Okumura, Kunihiro Kamataki, Naho Itagaki, Kazunori Koga, Tatsuyuki Nakatani, Masaharu Shiratani

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm-3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer.

Original language	English
Article number	100906
Journal	Japanese journal of applied physics
Volume	59
Issue number	10
DOIs	https://doi.org/10.35848/1347-4065/abbb20
Publication status	Published - Oct 2020

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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abstract = "Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm-3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer. ",

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T1 - Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

AU - Hwang, Sung Hwa

AU - Okumura, Takamasa

AU - Kamataki, Kunihiro

AU - Itagaki, Naho

AU - Koga, Kazunori

AU - Nakatani, Tatsuyuki

AU - Shiratani, Masaharu

PY - 2020/10

Y1 - 2020/10

N2 - Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm-3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer.

AB - Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm-3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer.

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Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

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