Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems

Seiya Matsuoka, Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages850-853
Number of pages4
ISBN (Electronic)9784904090138
DOIs
Publication statusPublished - May 20 2015
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: Apr 14 2015Apr 17 2015

Publication series

NameICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
CountryJapan
CityKyoto
Period4/14/154/17/15

Fingerprint

Microsystems
Atmospheric pressure
Nitrogen
Plasmas
Photoelectron spectroscopy
Temperature
X rays
Oxidation
Surface analysis
Chemical shift
Gases

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Matsuoka, S., Yamamoto, M., Higurashi, E., Suga, T., & Sawada, R. (2015). Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 850-853). [7111132] (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111132

Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems. / Matsuoka, Seiya; Yamamoto, Michitaka; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi.

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. p. 850-853 7111132 (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsuoka, S, Yamamoto, M, Higurashi, E, Suga, T & Sawada, R 2015, Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems. in ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference., 7111132, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Institute of Electrical and Electronics Engineers Inc., pp. 850-853, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015, Kyoto, Japan, 4/14/15. https://doi.org/10.1109/ICEP-IAAC.2015.7111132
Matsuoka S, Yamamoto M, Higurashi E, Suga T, Sawada R. Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc. 2015. p. 850-853. 7111132. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference). https://doi.org/10.1109/ICEP-IAAC.2015.7111132
Matsuoka, Seiya ; Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi. / Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems. ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 850-853 (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).
@inproceedings{943ddb0c88fa422ea71670eff806cad4,
title = "Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems",
abstract = "This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).",
author = "Seiya Matsuoka and Michitaka Yamamoto and Eiji Higurashi and Tadatomo Suga and Renshi Sawada",
year = "2015",
month = "5",
day = "20",
doi = "10.1109/ICEP-IAAC.2015.7111132",
language = "English",
series = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "850--853",
booktitle = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
address = "United States",

}

TY - GEN

T1 - Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems

AU - Matsuoka, Seiya

AU - Yamamoto, Michitaka

AU - Higurashi, Eiji

AU - Suga, Tadatomo

AU - Sawada, Renshi

PY - 2015/5/20

Y1 - 2015/5/20

N2 - This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).

AB - This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).

UR - http://www.scopus.com/inward/record.url?scp=84936128393&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84936128393&partnerID=8YFLogxK

U2 - 10.1109/ICEP-IAAC.2015.7111132

DO - 10.1109/ICEP-IAAC.2015.7111132

M3 - Conference contribution

AN - SCOPUS:84936128393

T3 - ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

SP - 850

EP - 853

BT - ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

PB - Institute of Electrical and Electronics Engineers Inc.

ER -