Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We report the low-temperature bonding of a lithium niobate (LiNbO 3) chip with gold (Au) thin film to a silicon (Si) substrate with patterned Au film for hybrid-integrated optical devices. The bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the Au thin film (thickness: 500 nm) on the LiNbO3 chip (6 mm by 6 mm) and the patterned Au film (thickness: 2 μm) on the Si substrate (12 mm by 12 mm) were cleaned by using argon (Ar) radio-frequency (RF) plasma, Au-Au bonding was carried out in ambient air with applied static pressure (̃50 kgf). The LiNbO3 chips were successfully bonded to the Si substrates at relatively low temperature (< 100 °C). However, when the bonding temperature was increased to be greater than 150 °C, the LiNbO3 chips cracked during bonding. The tensile strength (calculated by dividing the total cross-sectional area of the initial, undeformed micropatterns) of the interface was estimated to be about 70 MPa (bonding temperature: 100 °C). It was sufficient for use in optical applications. These results show the potential for producing highly functional optical devices and for low-cost packaging of LiNbO3 devices.

Original languageEnglish
Title of host publicationOptomechatronic Micro/Nano Devices and Components II
DOIs
Publication statusPublished - Dec 1 2006
EventOptomechatronic Micro/Nano Devices and Components II - Boston, MA, United States
Duration: Oct 3 2006Oct 4 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6376
ISSN (Print)0277-786X

Other

OtherOptomechatronic Micro/Nano Devices and Components II
CountryUnited States
CityBoston, MA
Period10/3/0610/4/06

Fingerprint

Optical devices
Waveguides
chips
waveguides
Silicon
air
silicon
Substrates
Air
Temperature
Film thickness
film thickness
Plasmas
Thin films
static pressure
thin films
lithium niobates
packaging
tensile strength
Argon

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Takigawa, R., Higurashi, E., Suga, T., Shinada, S., & Kawanishi, T. (2006). Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices. In Optomechatronic Micro/Nano Devices and Components II [637603] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6376). https://doi.org/10.1117/12.690741

Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices. / Takigawa, Ryo; Higurashi, Eiji; Suga, Tadatomo; Shinada, Satoshi; Kawanishi, Tetsuya.

Optomechatronic Micro/Nano Devices and Components II. 2006. 637603 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6376).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takigawa, R, Higurashi, E, Suga, T, Shinada, S & Kawanishi, T 2006, Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices. in Optomechatronic Micro/Nano Devices and Components II., 637603, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6376, Optomechatronic Micro/Nano Devices and Components II, Boston, MA, United States, 10/3/06. https://doi.org/10.1117/12.690741
Takigawa R, Higurashi E, Suga T, Shinada S, Kawanishi T. Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices. In Optomechatronic Micro/Nano Devices and Components II. 2006. 637603. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.690741
Takigawa, Ryo ; Higurashi, Eiji ; Suga, Tadatomo ; Shinada, Satoshi ; Kawanishi, Tetsuya. / Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices. Optomechatronic Micro/Nano Devices and Components II. 2006. (Proceedings of SPIE - The International Society for Optical Engineering).
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