Low temperature bonding of LiNbO3 waveguide chips to Si substrates in air

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi

Research output: Contribution to journalConference article

Abstract

This paper describes the low-temperature bonding of a lithium niobate (LiNbO3) waveguide chip to a silicon (Si) substrate for integrated optical systems. The bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au thin films (thickness: 100 nm) of the LiNbO3 chip and the Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. The bonded chips fractured at bonding temperature higher than 150°C because of the coefficient of thermal expansion (CTE) mismatch. The LiNbO3 chips were successfully bonded to the Si substrates at relatively low temperature (100°C). The die-shear strength of the LiNbO3 chip was estimated to be more than 12 kg (3.8 MPa), the upper limit of our shear testing equipment.

Original languageEnglish
Article number605012
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume6050
DOIs
Publication statusPublished - Dec 1 2005
EventOptomechatronic Micro/Nano Devices and Components - Sappora, Japan
Duration: Dec 5 2005Dec 7 2005

Fingerprint

Silicon
Waveguide
Waveguides
Chip
chips
Substrate
waveguides
air
silicon
Substrates
Air
Plasma
Temperature
Flip chip
Plasmas
Lithium Niobate
Coefficient of Thermal Expansion
Equipment testing
Shear Strength
Integrated System

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Low temperature bonding of LiNbO3 waveguide chips to Si substrates in air. / Takigawa, Ryo; Higurashi, Eiji; Suga, Tadatomo; Shinada, Satoshi; Kawanishi, Tetsuya.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 6050, 605012, 01.12.2005.

Research output: Contribution to journalConference article

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