Low-temperature bonding of LSI chips to polymer substrate using Au cone bump for flexible electronics

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

PEN (polyethylene naphthalate) is a promising polymer candidate of the substrate material for flexible electronics. But its glass transition temperature is as low as 150°C. We show that interconnection bonding of LSI chip to metallization on PEN film can be realized by using cone-shaped compliant bump. 20 um-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. Counter electrode on the PEN film was composed of Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by using electroless plating on patterned Al. We have investigated two designs of the counter electrode; one is simple metal pad and the other is an electrode in which cross-shaped slit was formed. The bonding between the cone-shaped bump and the simple pad electrode was found to be realized at 150°C. More than 10,000 connections with about 100 mΩ/bump were formed. When the cross-shaped slit was employed, room temperature bonding was achieved.

Original languageEnglish
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages1770-1774
Number of pages5
DOIs
Publication statusPublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Shuto, T., Watanabe, N., Ikeda, A., & Asano, T. (2011). Low-temperature bonding of LSI chips to polymer substrate using Au cone bump for flexible electronics. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 1770-1774). [5898752] https://doi.org/10.1109/ECTC.2011.5898752