Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure

E. Higurashi; D. Chino; T. Suga; R. Sawada

doi:10.1109/SENSOR.2009.5285712

Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure

E. Higurashi, D. Chino, T. Suga, R. Sawada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	1873-1876
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285712
Publication status	Published - Dec 11 2009
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: Jun 21 2009 → Jun 25 2009

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country	United States
City	Denver, CO
Period	6/21/09 → 6/25/09

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SENSOR.2009.5285712

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Higurashi, E., Chino, D., Suga, T., & Sawada, R. (2009). Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 1873-1876). [5285712] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285712

Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. / Higurashi, E.; Chino, D.; Suga, T.; Sawada, R.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 1873-1876 5285712 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Higurashi, E, Chino, D, Suga, T & Sawada, R 2009, Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285712, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1873-1876, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 6/21/09. https://doi.org/10.1109/SENSOR.2009.5285712

Higurashi E, Chino D, Suga T, Sawada R. Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 1873-1876. 5285712. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285712

Higurashi, E. ; Chino, D. ; Suga, T. ; Sawada, R. / Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 1873-1876 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

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