Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure

E. Higurashi, D. Chino, T. Suga, R. Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.

    Original languageEnglish
    Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
    Pages1873-1876
    Number of pages4
    DOIs
    Publication statusPublished - Dec 11 2009
    EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
    Duration: Jun 21 2009Jun 25 2009

    Publication series

    NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

    Other

    OtherTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
    CountryUnited States
    CityDenver, CO
    Period6/21/096/25/09

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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