Abstract
We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
| Original language | English |
|---|---|
| Title of host publication | TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems |
| Pages | 1873-1876 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - Dec 11 2009 |
| Event | TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: Jun 21 2009 → Jun 25 2009 |
Publication series
| Name | TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems |
|---|
Other
| Other | TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems |
|---|---|
| Country | United States |
| City | Denver, CO |
| Period | 6/21/09 → 6/25/09 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure. / Higurashi, E.; Chino, D.; Suga, T.; Sawada, R.
TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 1873-1876 5285712 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure
AU - Higurashi, E.
AU - Chino, D.
AU - Suga, T.
AU - Sawada, R.
PY - 2009/12/11
Y1 - 2009/12/11
N2 - We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
AB - We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
UR - http://www.scopus.com/inward/record.url?scp=71449106357&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=71449106357&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2009.5285712
DO - 10.1109/SENSOR.2009.5285712
M3 - Conference contribution
AN - SCOPUS:71449106357
SN - 9781424441938
T3 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 1873
EP - 1876
BT - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
ER -