TY - GEN
T1 - Low-temperature bonding of photodiodes on glass substrate using AU stud bumps and its application to microsensors with three-dimensional structure
AU - Higurashi, E.
AU - Chino, D.
AU - Suga, T.
AU - Sawada, R.
PY - 2009/12/11
Y1 - 2009/12/11
N2 - We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
AB - We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150° C. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors with three-dimensional structure (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
UR - http://www.scopus.com/inward/record.url?scp=71449106357&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=71449106357&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2009.5285712
DO - 10.1109/SENSOR.2009.5285712
M3 - Conference contribution
AN - SCOPUS:71449106357
SN - 9781424441938
T3 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 1873
EP - 1876
BT - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
T2 - TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Y2 - 21 June 2009 through 25 June 2009
ER -