Low-temperature direct flip-chip bonding for integrated micro-systems

E. Higurashi; T. Suga; Renshi Sawada

doi:10.1109/LEOS.2005.1547908

Low-temperature direct flip-chip bonding for integrated micro-systems

E. Higurashi, T. Suga, Renshi Sawada

Machine design and bionic systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

Original language	English
Title of host publication	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005
Pages	121-122
Number of pages	2
Volume	2005
DOIs	https://doi.org/10.1109/LEOS.2005.1547908
Publication status	Published - 2005
Event	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 - Sydney, Australia Duration: Oct 22 2005 → Oct 28 2005

Other

Other	18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005
Country	Australia
City	Sydney
Period	10/22/05 → 10/28/05

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All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering
Control and Systems Engineering
Electrical and Electronic Engineering

Cite this

Higurashi, E., Suga, T., & Sawada, R. (2005). Low-temperature direct flip-chip bonding for integrated micro-systems. In 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005 (Vol. 2005, pp. 121-122). [1547908] https://doi.org/10.1109/LEOS.2005.1547908

Higurashi, E, Suga, T & Sawada, R 2005, Low-temperature direct flip-chip bonding for integrated micro-systems. in 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005. vol. 2005, 1547908, pp. 121-122, 18th Annual Meeting of the IEEE Lasers and Electro-Optics Society, LEOS 2005, Sydney, Australia, 10/22/05. https://doi.org/10.1109/LEOS.2005.1547908

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AB - This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

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Access to Document

10.1109/LEOS.2005.1547908