Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems

Eiji Higurashi, Michitaka Yamamoto, So Ikeda, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Room temperature bonding of semiconductor chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using Ar+H2 atmospheric-pressure plasma activation was demonstrated in ambient air. Die shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of light-currentvoltage characteristics of laser diode chips and dark current of photodiode chips indicated no degradation after bonding. By applying this technique, miniaturized polarization sensors were fabricated.

Original languageEnglish
Title of host publication2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings
PublisherIEEE Computer Society
Pages89-90
Number of pages2
ISBN (Electronic)9780992841423
DOIs
Publication statusPublished - Oct 14 2014
Event2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Glasgow, United Kingdom
Duration: Aug 17 2014Aug 21 2014

Publication series

NameInternational Conference on Optical MEMS and Nanophotonics
ISSN (Print)2160-5033
ISSN (Electronic)2160-5041

Other

Other2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014
CountryUnited Kingdom
CityGlasgow
Period8/17/148/21/14

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Higurashi, E., Yamamoto, M., Ikeda, S., Suga, T., & Sawada, R. (2014). Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. In 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings (pp. 89-90). [6924607] (International Conference on Optical MEMS and Nanophotonics). IEEE Computer Society. https://doi.org/10.1109/OMN.2014.6924607