Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems

Eiji Higurashi; Michitaka Yamamoto; So Ikeda; Tadatomo Suga; Renshi Sawada

doi:10.1109/OMN.2014.6924607

Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems

Eiji Higurashi, Michitaka Yamamoto, So Ikeda, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Room temperature bonding of semiconductor chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using Ar+H2 atmospheric-pressure plasma activation was demonstrated in ambient air. Die shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of light-currentvoltage characteristics of laser diode chips and dark current of photodiode chips indicated no degradation after bonding. By applying this technique, miniaturized polarization sensors were fabricated.

Original language	English
Title of host publication	2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings
Publisher	IEEE Computer Society
Pages	89-90
Number of pages	2
ISBN (Electronic)	9780992841423
DOIs	https://doi.org/10.1109/OMN.2014.6924607
Publication status	Published - Oct 14 2014
Event	2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Glasgow, United Kingdom Duration: Aug 17 2014 → Aug 21 2014

Publication series

Name	International Conference on Optical MEMS and Nanophotonics
ISSN (Print)	2160-5033
ISSN (Electronic)	2160-5041

Other

Other	2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014
Country	United Kingdom
City	Glasgow
Period	8/17/14 → 8/21/14

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/OMN.2014.6924607

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Cite this

Higurashi, E., Yamamoto, M., Ikeda, S., Suga, T., & Sawada, R. (2014). Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. In 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings (pp. 89-90). [6924607] (International Conference on Optical MEMS and Nanophotonics). IEEE Computer Society. https://doi.org/10.1109/OMN.2014.6924607

Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. / Higurashi, Eiji; Yamamoto, Michitaka; Ikeda, So; Suga, Tadatomo; Sawada, Renshi.

2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings. IEEE Computer Society, 2014. p. 89-90 6924607 (International Conference on Optical MEMS and Nanophotonics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Higurashi, E, Yamamoto, M, Ikeda, S, Suga, T & Sawada, R 2014, Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. in 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings., 6924607, International Conference on Optical MEMS and Nanophotonics, IEEE Computer Society, pp. 89-90, 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014, Glasgow, United Kingdom, 8/17/14. https://doi.org/10.1109/OMN.2014.6924607

Higurashi E, Yamamoto M, Ikeda S, Suga T, Sawada R. Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. In 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings. IEEE Computer Society. 2014. p. 89-90. 6924607. (International Conference on Optical MEMS and Nanophotonics). https://doi.org/10.1109/OMN.2014.6924607

Higurashi, Eiji ; Yamamoto, Michitaka ; Ikeda, So ; Suga, Tadatomo ; Sawada, Renshi. / Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems. 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings. IEEE Computer Society, 2014. pp. 89-90 (International Conference on Optical MEMS and Nanophotonics).

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