TY - GEN
T1 - Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems
AU - Higurashi, Eiji
AU - Yamamoto, Michitaka
AU - Ikeda, So
AU - Suga, Tadatomo
AU - Sawada, Renshi
PY - 2014/10/14
Y1 - 2014/10/14
N2 - Room temperature bonding of semiconductor chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using Ar+H2 atmospheric-pressure plasma activation was demonstrated in ambient air. Die shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of light-currentvoltage characteristics of laser diode chips and dark current of photodiode chips indicated no degradation after bonding. By applying this technique, miniaturized polarization sensors were fabricated.
AB - Room temperature bonding of semiconductor chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using Ar+H2 atmospheric-pressure plasma activation was demonstrated in ambient air. Die shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of light-currentvoltage characteristics of laser diode chips and dark current of photodiode chips indicated no degradation after bonding. By applying this technique, miniaturized polarization sensors were fabricated.
UR - http://www.scopus.com/inward/record.url?scp=84908053239&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908053239&partnerID=8YFLogxK
U2 - 10.1109/OMN.2014.6924607
DO - 10.1109/OMN.2014.6924607
M3 - Conference contribution
AN - SCOPUS:84908053239
T3 - International Conference on Optical MEMS and Nanophotonics
SP - 89
EP - 90
BT - 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings
PB - IEEE Computer Society
T2 - 2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014
Y2 - 17 August 2014 through 21 August 2014
ER -