Low-temperature gold-gold bonding using argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optical microsystems

Eiji Higurashi, Michitaka Yamamoto, So Ikeda, Tadatomo Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    Room temperature bonding of semiconductor chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using Ar+H2 atmospheric-pressure plasma activation was demonstrated in ambient air. Die shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of light-currentvoltage characteristics of laser diode chips and dark current of photodiode chips indicated no degradation after bonding. By applying this technique, miniaturized polarization sensors were fabricated.

    Original languageEnglish
    Title of host publication2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Proceedings
    PublisherIEEE Computer Society
    Pages89-90
    Number of pages2
    ISBN (Electronic)9780992841423
    DOIs
    Publication statusPublished - Oct 14 2014
    Event2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014 - Glasgow, United Kingdom
    Duration: Aug 17 2014Aug 21 2014

    Publication series

    NameInternational Conference on Optical MEMS and Nanophotonics
    ISSN (Print)2160-5033
    ISSN (Electronic)2160-5041

    Other

    Other2014 International Conference on Optical MEMS and Nanophotonics, OMN 2014
    CountryUnited Kingdom
    CityGlasgow
    Period8/17/148/21/14

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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