Abstract
Effects of Fe/Si ratio and growth temperature were investigated in order to realize high quality Fe<sub>3</sub>Si/Ge structures. It was found that very small <i>X</i>min values (2-3%) were achieved in a wide temperature range of 60-200°C under the stoichiometric condition. From TEM observation, it was rvealed that the Fe<sub>3</sub>Si/Ge structures with atomically flat interfaces were realized. In addition, thermal stability of the Fe<sub>3</sub>Si/Ge structures was guaranteed up to 400°C. These results suggested that growth at a low temperature (<200°C) under the stoichiometric condition was essential to obtain high quality Fe<sub>3</sub>Si/Ge structures with sharp interfaces.
Original language | English |
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Pages (from-to) | 708-711 |
Number of pages | 4 |
Journal | IEICE Transactions on Electronics |
Volume | 91 |
Issue number | 5 |
DOIs | |
Publication status | Published - May 1 2008 |