Abstract
We demonstrate low-temperature high-density chip-stack interconnection using compliant bump. Low temperature chip stacking was carried out by two methods; (1) plasma cleaning of compliant bumps, (2) mechanical caulking using compliant bump and doughnut-shaped electrode. The latter method is very effective in realizing chip stacking even at room temperature.
Original language | English |
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Title of host publication | Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 |
Pages | 622-626 |
Number of pages | 5 |
DOIs | |
Publication status | Published - Oct 22 2007 |
Event | 57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: May 29 2007 → Jun 1 2007 |
Other
Other | 57th Electronic Components and Technology Conference 2007, ECTC '07 |
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Country | United States |
City | Sparks, NV |
Period | 5/29/07 → 6/1/07 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering