Abstract
For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).
| Original language | English |
|---|---|
| Title of host publication | 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 |
| Pages | 1384-1387 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2011 |
| Event | 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China Duration: Jun 5 2011 → Jun 9 2011 |
Other
| Other | 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 |
|---|---|
| Country | China |
| City | Beijing |
| Period | 6/5/11 → 6/9/11 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. / Yamamoto, S.; Higurashi, E.; Suga, T.; Sawada, Renshi.
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1384-1387 5969529.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment
AU - Yamamoto, S.
AU - Higurashi, E.
AU - Suga, T.
AU - Sawada, Renshi
PY - 2011
Y1 - 2011
N2 - For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).
AB - For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).
UR - http://www.scopus.com/inward/record.url?scp=80052128749&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80052128749&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2011.5969529
DO - 10.1109/TRANSDUCERS.2011.5969529
M3 - Conference contribution
AN - SCOPUS:80052128749
SN - 9781457701573
SP - 1384
EP - 1387
BT - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
ER -