Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

S. Yamamoto, E. Higurashi, T. Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

Original languageEnglish
Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages1384-1387
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
Duration: Jun 5 2011Jun 9 2011

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
CountryChina
CityBeijing
Period6/5/116/9/11

Fingerprint

Microsystems
Atmospheric pressure
Temperature
Packaging
Ultrahigh vacuum
Air

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Yamamoto, S., Higurashi, E., Suga, T., & Sawada, R. (2011). Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 (pp. 1384-1387). [5969529] https://doi.org/10.1109/TRANSDUCERS.2011.5969529

Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. / Yamamoto, S.; Higurashi, E.; Suga, T.; Sawada, Renshi.

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1384-1387 5969529.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamamoto, S, Higurashi, E, Suga, T & Sawada, R 2011, Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11., 5969529, pp. 1384-1387, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, Beijing, China, 6/5/11. https://doi.org/10.1109/TRANSDUCERS.2011.5969529
Yamamoto S, Higurashi E, Suga T, Sawada R. Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1384-1387. 5969529 https://doi.org/10.1109/TRANSDUCERS.2011.5969529
Yamamoto, S. ; Higurashi, E. ; Suga, T. ; Sawada, Renshi. / Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. pp. 1384-1387
@inproceedings{b4aba2f12b7645399083de5f2bd76373,
title = "Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment",
abstract = "For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).",
author = "S. Yamamoto and E. Higurashi and T. Suga and Renshi Sawada",
year = "2011",
doi = "10.1109/TRANSDUCERS.2011.5969529",
language = "English",
isbn = "9781457701573",
pages = "1384--1387",
booktitle = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11",

}

TY - GEN

T1 - Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

AU - Yamamoto, S.

AU - Higurashi, E.

AU - Suga, T.

AU - Sawada, Renshi

PY - 2011

Y1 - 2011

N2 - For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

AB - For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

UR - http://www.scopus.com/inward/record.url?scp=80052128749&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80052128749&partnerID=8YFLogxK

U2 - 10.1109/TRANSDUCERS.2011.5969529

DO - 10.1109/TRANSDUCERS.2011.5969529

M3 - Conference contribution

AN - SCOPUS:80052128749

SN - 9781457701573

SP - 1384

EP - 1387

BT - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

ER -