Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

S. Yamamoto; E. Higurashi; T. Suga; Renshi Sawada

doi:10.1109/TRANSDUCERS.2011.5969529

Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

S. Yamamoto, E. Higurashi, T. Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

Original language	English
Title of host publication	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages	1384-1387
Number of pages	4
DOIs	https://doi.org/10.1109/TRANSDUCERS.2011.5969529
Publication status	Published - 2011
Event	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China Duration: Jun 5 2011 → Jun 9 2011

Other

Other	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Country	China
City	Beijing
Period	6/5/11 → 6/9/11

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/TRANSDUCERS.2011.5969529

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Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. / Yamamoto, S.; Higurashi, E.; Suga, T.; Sawada, Renshi.

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 1384-1387 5969529.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamamoto, S, Higurashi, E, Suga, T & Sawada, R 2011, Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment. in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11., 5969529, pp. 1384-1387, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, Beijing, China, 6/5/11. https://doi.org/10.1109/TRANSDUCERS.2011.5969529

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abstract = "For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).",

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