Low-temperature sealing for optical microsystem packages using Au-Au surface activated bonding in atmospheric pressure environment

S. Yamamoto, E. Higurashi, T. Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    For chip-size packaging of optical microsystems, surface activated bonding (SAB) method is one attractive candidate because of its low-temperature process. However, most of packaging processes with SAB method have been performed under ultra-high vacuum conditions, because it needs maintaining the activated surface during bonding process. In this study, we demonstrate low-temperature hermetic sealing at atmospheric pressure using Au-Au SAB, because Au is not oxidized and its activated surface can be kept for several tens of minutes in ambient air. Strong bonding force and hermeticity were experimentally confirmed by low-temperature SAB bonding (150 °C).

    Original languageEnglish
    Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
    Pages1384-1387
    Number of pages4
    DOIs
    Publication statusPublished - 2011
    Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
    Duration: Jun 5 2011Jun 9 2011

    Other

    Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
    CountryChina
    CityBeijing
    Period6/5/116/9/11

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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