Low-temperature superplasticity in a Cu-Zn-Sn alloy processed by severe plastic deformation

K. Neishi, T. Uchida, A. Yamauchi, K. Nakamura, Z. Horita, T. G. Langdon

    Research output: Contribution to journalArticlepeer-review

    68 Citations (Scopus)

    Abstract

    A copper alloy containing ~ 38% Zn and ~ 3% Sn was subjected to severe plastic deformation at a temperature of 400°C using the procedure of equal-channel angular pressing (ECAP). The microstructures produced by ECAP were relatively heterogeneous with areas of both recrystallized and unrecrystallized grains. Within the recrystallized areas, the average grain size was ~ 1.5μm. Tensile testing after ECAP revealed the occurrence of superplasticity with elongations up to ~ 900%. Superplastic ductilities were recorded at temperatures as low as 300°C corresponding to an homologous temperature of ~ 0.51Tm, where Tm is the absolute melting temperature of the alloy. These results demonstrate the potential for achieving low temperature superplasticity in this alloy through ECAP. As in conventional superplastic Cu-based alloys, specimens failed because of the development of internal cavities.

    Original languageEnglish
    Pages (from-to)23-28
    Number of pages6
    JournalMaterials Science and Engineering A
    Volume307
    Issue number1-2
    DOIs
    Publication statusPublished - Jun 15 2001

    All Science Journal Classification (ASJC) codes

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

    Fingerprint

    Dive into the research topics of 'Low-temperature superplasticity in a Cu-Zn-Sn alloy processed by severe plastic deformation'. Together they form a unique fingerprint.

    Cite this