Macroscopically and atomically smooth YBa2Cu3O7 film grown by reactive rapid sequential pulse laser deposition

Yukio Watanabe, M. Tanamura, H. Asami, Y. Matsumoto, Y. Seki, S. Matsumoto

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A modified version of pulsed laser deposition : Rapid Sequential Pulsed Laser Deposition (RS-PLD) is proposed. The 500 A thick YBa2Cu3O7 (YBCO) films with Tc=80∼90K were grown in-situ by sequentially irradiating metal targets. Typically, no particulates were observed in the surface area of 100 μm by 100 μm. Fittings to the Grazing Incidence X-ray reflectance (GIXR) gave the surface roughness of ±1.5 A for those on MgO and ±9A for those on SrTiO3.

Original languageEnglish
Pages (from-to)579-580
Number of pages2
JournalPhysica C: Superconductivity and its applications
Volume235-240
Issue numberPART 1
DOIs
Publication statusPublished - Jan 1 1994

Fingerprint

laser deposition
Pulsed laser deposition
pulsed laser deposition
Laser pulses
pulses
grazing incidence
Thick films
particulates
thick films
surface roughness
Surface roughness
Metals
reflectance
X rays
metals
x rays
barium copper yttrium oxide
strontium titanium oxide

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Macroscopically and atomically smooth YBa2Cu3O7 film grown by reactive rapid sequential pulse laser deposition. / Watanabe, Yukio; Tanamura, M.; Asami, H.; Matsumoto, Y.; Seki, Y.; Matsumoto, S.

In: Physica C: Superconductivity and its applications, Vol. 235-240, No. PART 1, 01.01.1994, p. 579-580.

Research output: Contribution to journalArticle

Watanabe, Yukio ; Tanamura, M. ; Asami, H. ; Matsumoto, Y. ; Seki, Y. ; Matsumoto, S. / Macroscopically and atomically smooth YBa2Cu3O7 film grown by reactive rapid sequential pulse laser deposition. In: Physica C: Superconductivity and its applications. 1994 ; Vol. 235-240, No. PART 1. pp. 579-580.
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