Magnetic microprobe for surface imaging with enhanced spatial resolution

I. Sasada, T. Tomonari, T. Noda

Research output: Contribution to journalConference articlepeer-review

Abstract

A new magnetic microprobe is proposed for nondestructive defects imaging of conductors or magnetic materials with submillimeter resolution. The probe consists of a pair of thin amorphous wire cores bent in the U-shape and four identical copper wire coils wound on the wire cores.

Original languageEnglish
Pages (from-to)BS-15
JournalDigests of the Intermag Conference
DOIs
Publication statusPublished - 1999
EventProceedings of the 1999 IEEE International Magnetics Conference 'Digest of Intermag 99' - Kyongju, South Korea
Duration: May 18 1999May 21 1999

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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