Mechanism of toughening in ferritic iron by solute copper at low temperature

Junaidi Syarif, Toshihiro Tsuchiyama, Setsuo Takaki

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The ductile-to-brittle transition (DBT) and plastic deformation behaviors were investigated in Fe-(0-2)mass%Cu alloys to understand the effect of solute Cu on the mechanical properties of ferritic iron. The DBT temperature of ferritic iron in Charpy impact test was lowered by the solute Cu although the hardness at room temperature was increased owing to solid solution hardening. Tensile tests revealed that the yield stress of the Fe-1mass%Cu alloy becomes smaller than that of the Fe-Omass%Cu alloy in the temperature range below 223 K through solid solution softening by Cu. The solid solution softening makes slip deformation easy to occur even at such a lower temperature and also at high strain rate. This leads to suppressing twin deformation which induces brittle fracture of ferritic iron at low temperature, and resulting in the shift of DBT temperature to lower side.

Original languageEnglish
Pages (from-to)1100-1104
Number of pages5
Journalisij international
Volume43
Issue number7
DOIs
Publication statusPublished - Jan 1 2003

Fingerprint

Toughening
Copper
Iron
Solid solutions
Superconducting transition temperature
Temperature
Brittle fracture
Yield stress
Hardening
Strain rate
Plastic deformation
Hardness
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

Mechanism of toughening in ferritic iron by solute copper at low temperature. / Syarif, Junaidi; Tsuchiyama, Toshihiro; Takaki, Setsuo.

In: isij international, Vol. 43, No. 7, 01.01.2003, p. 1100-1104.

Research output: Contribution to journalArticle

Syarif, Junaidi ; Tsuchiyama, Toshihiro ; Takaki, Setsuo. / Mechanism of toughening in ferritic iron by solute copper at low temperature. In: isij international. 2003 ; Vol. 43, No. 7. pp. 1100-1104.
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