Micro-machining and fine-assembling technologies functionally merge the monolithic formation process of opto-electronic semiconductors and dielectric materials. This paper describes (1) circular parallel beam conversion from the elliptical emission of a laser diode using a microlens and an adjustment free assembly method using an optical fiber guide formed on the laser substrate, (2) a micro-pump that finely controls the removal of liquid for an optical cross connection using a planner waveguides with narrow grooves where the light paths are switched to transmission or reflection by a refractive index matching liquid, and (3) fine assembling technology of a laser diode array using a laser position sensor.
|Number of pages||10|
|Journal||NTT R and D|
|Publication status||Published - Dec 1 1993|
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering