The metal-induced low-temperature (≤550°C) crystallization of a-Si1-xGex (0 ≤ × ≤ 1) on SiO2 has been investigated. A Ge-fraction-dependent crystal growth was observed. In the case of a low-Ge fraction, plane growth dominated, the velocity of which was enhanced by 80% with increasing Ge fraction from 0 to 20%. This produced strain-free poly-SiGe with large grains (18 μm). On the other hand, dendrite growth became dominant in the case of intermediate Ge fractions (40-60%). By optimizing the growth conditions (x: 0.4, annealing: 450°C, 20 h), very sharp needlelike crystals (width: 0.05 μm, length: 10 μm) were obtained. These new polycrystalline SiGe films on insulator should be used for system-in-display, three-dimensional ultra large-scall integrated circuits, and novel one-dimensional wires.
|Number of pages||4|
|Journal||Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers|
|Issue number||4 B|
|Publication status||Published - Apr 2003|
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)