Metal plating via electrochemical reduction of oxide layers formed by electrophoretic deposition

Kai Kamada, Naoya Enomoto, Junichi Hojo

    Research output: Contribution to journalArticlepeer-review

    3 Citations (Scopus)

    Abstract

    A novel electroplating technique is proposed using simple and non-toxic aqueous solutions in contrast with conventional plating baths. The metal plating process consists of a two-step procedure, i.e., combination of well-known electrophoretic deposition (EPD) and electrochemical reduction. Initially, the EPD of metal oxide particles dispersed in pure water is performed so that an oxide layer can be formed on the electrode surface. The coating layer is then electrochemically reduced to the metallic state in a neutral electrolyte solution. Dissolution-precipitation of the oxide in the second step plays an important role in densification of the resultant metal film. This communication briefly discusses the electroplating mechanism and the effectiveness of the proposed technique.

    Original languageEnglish
    Pages (from-to)926-928
    Number of pages3
    JournalJournal of the Ceramic Society of Japan
    Volume117
    Issue number1368
    DOIs
    Publication statusPublished - Aug 2009

    All Science Journal Classification (ASJC) codes

    • Ceramics and Composites
    • Chemistry(all)
    • Condensed Matter Physics
    • Materials Chemistry

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