Micro drilling into brittle materials by chemically plated diamond tools

H. K. Park, H. Onikura, O. Ohnishi, Takao Sajima, A. Sharifuddin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present research aims at efficient and high-quality micro drilling into brittle materials. Step feed drilling and helical feed drilling into silicon with an aspect ratio of about 1.5 were tried using chemically plated cylindrical diamond tools with a diameter of 120um. In step feed drilling significant tool wear and chip loading were observed on the end face and on the circumferential tip part, respectively. The tool life was restricted up to 30 holes and the hole diameter at the entrance was oversized. Drilling time was so long due to many steps of small feed. On the other hand, in helical feed drilling longer tool life was obtained than in step feed one. In helical feed drilling, a tool life of 400 holes was obtained at longest under a revolution radius of 0.02mm and a circumferential feed rate of 0.1mm/min. The tool life is about 13 times of that in step feed drilling. Under a circumferential feed rate of 0.3mm/min a chipping of 50um was observed at maximum on the entrance edge of 230th hole.

Original languageEnglish
Title of host publicationProceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
Publishereuspen
Pages465-468
Number of pages4
Volume2
ISBN (Electronic)9780955308253
Publication statusPublished - 2008
Event10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008 - Zurich, Switzerland
Duration: May 18 2008May 22 2008

Other

Other10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
CountrySwitzerland
CityZurich
Period5/18/085/22/08

Fingerprint

brittle materials
Diamond
Brittleness
drilling
Diamonds
Drilling
diamonds
entrances
chipping
Silicon
aspect ratio
Aspect ratio
chips
Wear of materials
radii
silicon

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Mechanical Engineering
  • Materials Science(all)
  • Environmental Engineering
  • Industrial and Manufacturing Engineering

Cite this

Park, H. K., Onikura, H., Ohnishi, O., Sajima, T., & Sharifuddin, A. (2008). Micro drilling into brittle materials by chemically plated diamond tools. In Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008 (Vol. 2, pp. 465-468). euspen.

Micro drilling into brittle materials by chemically plated diamond tools. / Park, H. K.; Onikura, H.; Ohnishi, O.; Sajima, Takao; Sharifuddin, A.

Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008. Vol. 2 euspen, 2008. p. 465-468.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Park, HK, Onikura, H, Ohnishi, O, Sajima, T & Sharifuddin, A 2008, Micro drilling into brittle materials by chemically plated diamond tools. in Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008. vol. 2, euspen, pp. 465-468, 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008, Zurich, Switzerland, 5/18/08.
Park HK, Onikura H, Ohnishi O, Sajima T, Sharifuddin A. Micro drilling into brittle materials by chemically plated diamond tools. In Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008. Vol. 2. euspen. 2008. p. 465-468
Park, H. K. ; Onikura, H. ; Ohnishi, O. ; Sajima, Takao ; Sharifuddin, A. / Micro drilling into brittle materials by chemically plated diamond tools. Proceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008. Vol. 2 euspen, 2008. pp. 465-468
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