Micro fabrication process of powder compact with semi-solid mold

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

New powder compaction process, in which a Bingham semi-solid/fluid mold is utilized, is developed to fabricate micro parts. In the present process, a powder material is filled as slurry in a solid wax mold, dried and compressed by either of conventional pressing methods, such as isostatic pressing or die compaction. It is important to use slurry for filling because dry powder is hard to fill in the micro cavity. It is also essential to control process temperature to treat micro parts. The wax mold is heated during compaction and becomes semi-solid state, which can acts as a pressurized medium for isostatic compaction. Since the compacted micro parts are very fragile, the mold's temperature is controlled to higher than its melting point during unloading, to avoid breakage of the compacts. To demonstrate effectiveness of this process, some micro compacts of alumina are shown as examples.

Original languageEnglish
Title of host publicationProgress in Powder Metallurgy - Proceedings of the 2006 Powder Metallurgy World Congress and Exhibition (PM 2006)
Pages473-476
Number of pages4
Volume534-536
EditionPART 1
Publication statusPublished - 2007
Externally publishedYes
Event2006 Powder Metallurgy World Congress and Exhibition, PM 2006 - Busan, Korea, Republic of
Duration: Sep 24 2006Sep 28 2006

Publication series

NameMaterials Science Forum
NumberPART 1
Volume534-536
ISSN (Print)02555476

Other

Other2006 Powder Metallurgy World Congress and Exhibition, PM 2006
CountryKorea, Republic of
CityBusan
Period9/24/069/28/06

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Tsumori, F. (2007). Micro fabrication process of powder compact with semi-solid mold. In Progress in Powder Metallurgy - Proceedings of the 2006 Powder Metallurgy World Congress and Exhibition (PM 2006) (PART 1 ed., Vol. 534-536, pp. 473-476). (Materials Science Forum; Vol. 534-536, No. PART 1).