Micro-grid fabrication of fluorinated polyimide by using magnetically controlled reactive ion etching (MC-RIE)

Akinori Furuya, Fusao Shimokawa, Tohru Matsuura, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

A micro-grid consisting of 100-μm-high pole-shaped counter-electrode elements arranged like a pair of interleaved combs was fabricated using a fluorinated polyimide as structural material and metallization and lift-off using a ZnO sacrificial layer. Our research into the magnetically controlled reactive ion etching (MC-RIE) of fluorinated polyimide substrate has result in an etching selectivity of up to 2600. These conditions result in a smooth etched surface. Shaped constructions hundreds of micrometers high with a good perpendicular shape can be formed using MC-RIE technique for fluorinated polyimide micro-fabrication. Moreover, many kinds of 3-dimensional structural devices can be manufactured when this technology is combined to a lift-off method using a ZnO sacrificial layer.

Original languageEnglish
Title of host publicationIEEE Micro Electro Mechanical Systems
PublisherPubl by IEEE
Pages59-65
Number of pages7
ISBN (Print)0780309588
Publication statusPublished - Jan 1 1993
EventProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS - Fort Lauderdale, FL, USA
Duration: Feb 7 1993Feb 10 1993

Publication series

NameIEEE Micro Electro Mechanical Systems

Other

OtherProceedings of the 1993 IEEE Micro Electro Mechanical Systems - MEMS
CityFort Lauderdale, FL, USA
Period2/7/932/10/93

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Furuya, A., Shimokawa, F., Matsuura, T., & Sawada, R. (1993). Micro-grid fabrication of fluorinated polyimide by using magnetically controlled reactive ion etching (MC-RIE). In IEEE Micro Electro Mechanical Systems (pp. 59-65). (IEEE Micro Electro Mechanical Systems). Publ by IEEE.