Micro oscillation heat pipe fabricated on silicon wafer

Masamichi Kohno, Takashi Nishizono, Yasunori Onaka, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Heat transport characteristics of micro oscillation heat pipe have been investigated. A single winding flow path consists of 28 turns microchannels fabricated on a silicon wafer the size of which was 31mmx27mm. We used heat pipe with non-uniformed cross section. Equivalent diameters of channels were 0.19 and 0.10mm. Test fluid was R141b and liquid fractions were 0, 75, 85%. It was found that steady pulsating flow occurred by increasing the number of turns and the frequency of vibration has an effect on heat transfer performance.

Original languageEnglish
Title of host publicationProceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008
Pages1343-1346
Number of pages4
EditionPART B
DOIs
Publication statusPublished - Dec 1 2008
Event6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008 - Darmstadt, Germany
Duration: Jun 23 2008Jun 25 2008

Publication series

NameProceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008
NumberPART B

Other

Other6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008
CountryGermany
CityDarmstadt
Period6/23/086/25/08

Fingerprint

Heat pipes
Silicon wafers
Steady flow
Microchannels
Heat transfer
Fluids
Liquids
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology

Cite this

Kohno, M., Nishizono, T., Onaka, Y., Hidaka, S., Takahashi, K., & Takata, Y. (2008). Micro oscillation heat pipe fabricated on silicon wafer. In Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008 (PART B ed., pp. 1343-1346). (Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008; No. PART B). https://doi.org/10.1115/ICNMM2008-62082

Micro oscillation heat pipe fabricated on silicon wafer. / Kohno, Masamichi; Nishizono, Takashi; Onaka, Yasunori; Hidaka, Sumitomo; Takahashi, Koji; Takata, Yasuyuki.

Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008. PART B. ed. 2008. p. 1343-1346 (Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008; No. PART B).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kohno, M, Nishizono, T, Onaka, Y, Hidaka, S, Takahashi, K & Takata, Y 2008, Micro oscillation heat pipe fabricated on silicon wafer. in Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008. PART B edn, Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008, no. PART B, pp. 1343-1346, 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008, Darmstadt, Germany, 6/23/08. https://doi.org/10.1115/ICNMM2008-62082
Kohno M, Nishizono T, Onaka Y, Hidaka S, Takahashi K, Takata Y. Micro oscillation heat pipe fabricated on silicon wafer. In Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008. PART B ed. 2008. p. 1343-1346. (Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008; PART B). https://doi.org/10.1115/ICNMM2008-62082
Kohno, Masamichi ; Nishizono, Takashi ; Onaka, Yasunori ; Hidaka, Sumitomo ; Takahashi, Koji ; Takata, Yasuyuki. / Micro oscillation heat pipe fabricated on silicon wafer. Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008. PART B. ed. 2008. pp. 1343-1346 (Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008; PART B).
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