Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano

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7 Citations (Scopus)

Abstract

We show that microjoining of LSI chips on a film made of poly(ethylene naphthalate) (PEN), whose glass transition temperature is 155°C, can be realized by using a cone-shaped compliant bump for flexible electronics. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. The bonding was carried out at 150°C. More than 10,000 connections with 108 mΩ/bump were achieved. Mechanical analysis using finite element method indicates that the joining is due to deformation of the cone-shaped Au bumps.

Original languageEnglish
Article number06GM05
JournalJapanese Journal of Applied Physics
Volume50
Issue number6 PART 2
DOIs
Publication statusPublished - Jun 1 2011

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All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Shuto, T., Watanabe, N., Ikeda, A., Higashimachi, T., & Asano, T. (2011). Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump. Japanese Journal of Applied Physics, 50(6 PART 2), [06GM05]. https://doi.org/10.1143/JJAP.50.06GM05