We show that microjoining of LSI chips on a film made of poly(ethylene naphthalate) (PEN), whose glass transition temperature is 155°C, can be realized by using a cone-shaped compliant bump for flexible electronics. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. The bonding was carried out at 150°C. More than 10,000 connections with 108 mΩ/bump were achieved. Mechanical analysis using finite element method indicates that the joining is due to deformation of the cone-shaped Au bumps.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)