Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump

Physics

• Polyethylene 66%
• Area 33%
• Deformation 33%
• Arrays 33%
• Electrodes 33%
• Counters 33%
• Photolithography 33%
• Flexible Electronics 33%
• Electroplating 33%
• Glass Transition Temperature 33%

Material Science

• Finite Element Modeling 100%
• Liquid Films 66%
• Mechanical Testing 33%

Engineering

• Deformation 33%
• Pitch 33%
• Flexible Electronics 33%
• Si Wafer 33%
• Layered Structure 33%
• Electroless Plating 33%