Micromachining of transparent materials with Fresnel diffraction of infrared radiation

K. Okazaki, S. Torii, T. Makimura, H. Niino, K. Murakami, Daisuke Nakamura, Akihiko Takahashi, T. Okada

Research output: Contribution to journalArticle

Abstract

A simple and productive micromachining method of a silica glass using a TEA (transversely excited atmospheric) CO2 laser (10.6 μm) was investigated. A copper grid mask with a thickness of 2 μm, square apertures of 20×20 μm was attached to the silica glass surface, and it was irradiated by the TEA CO2 laser light. As a result, circular holes were formed on the silica glass surface at the center of each aperture in a spatial resolution down to the sub-wavelength scale. The minimum diameter of the hole was less than 3 μm, which is less than one third of the wavelength of the TEA CO2 laser. A depth of the holes ranging from 100 nm to 600 nm could be micromachined on silica glass surface. The mechanism of the micromachining was discussed based on electric field distributions of the CO2 laser light by a 3D full-wave electromagnetic field simulation solver. The simulation results are in good agreement with the experimental results. It was found that the micromachining of the circular holes were caused by Fresnel diffraction of the CO2 laser light at the apertures.

Original languageEnglish
Pages (from-to)269-272
Number of pages4
JournalJournal of Laser Micro Nanoengineering
Volume5
Issue number3
DOIs
Publication statusPublished - Dec 1 2010

Fingerprint

Fresnel diffraction
transparence
Micromachining
infrared radiation
silica glass
micromachining
TEA lasers
Fused silica
Diffraction
Infrared radiation
Lasers
apertures
Wavelength
wavelengths
lasers
electromagnetic fields
masks
simulation
spatial resolution
Electromagnetic fields

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Micromachining of transparent materials with Fresnel diffraction of infrared radiation. / Okazaki, K.; Torii, S.; Makimura, T.; Niino, H.; Murakami, K.; Nakamura, Daisuke; Takahashi, Akihiko; Okada, T.

In: Journal of Laser Micro Nanoengineering, Vol. 5, No. 3, 01.12.2010, p. 269-272.

Research output: Contribution to journalArticle

Okazaki, K. ; Torii, S. ; Makimura, T. ; Niino, H. ; Murakami, K. ; Nakamura, Daisuke ; Takahashi, Akihiko ; Okada, T. / Micromachining of transparent materials with Fresnel diffraction of infrared radiation. In: Journal of Laser Micro Nanoengineering. 2010 ; Vol. 5, No. 3. pp. 269-272.
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