Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

N. Kawamoto; Y. Murakami; D. Shindo; K. Suganuma

doi:10.1109/POLYTR.2007.4339147

Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

N. Kawamoto, Y. Murakami, D. Shindo, K. Suganuma

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

Original language	English
Title of host publication	6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
Pages	101-104
Number of pages	4
DOIs	https://doi.org/10.1109/POLYTR.2007.4339147
Publication status	Published - Dec 1 2007
Externally published	Yes
Event	Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan Duration: Jan 15 2007 → Jan 18 2007

Publication series

Name	6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Other

Other	Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Country/Territory	Japan
City	Tokyo
Period	1/15/07 → 1/18/07

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Polymers and Plastics

Access to Document

10.1109/POLYTR.2007.4339147

Cite this

Kawamoto, N., Murakami, Y., Shindo, D., & Suganuma, K. (2007). Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder. In 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings (pp. 101-104). [4339147] (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings). https://doi.org/10.1109/POLYTR.2007.4339147

Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder. / Kawamoto, N.; Murakami, Y.; Shindo, D. et al.
6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. p. 101-104 4339147 (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kawamoto, N, Murakami, Y, Shindo, D & Suganuma, K 2007, Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder. in 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings., 4339147, 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings, pp. 101-104, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, Japan, 1/15/07. https://doi.org/10.1109/POLYTR.2007.4339147

Kawamoto N, Murakami Y, Shindo D, Suganuma K. Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder. In 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. p. 101-104. 4339147. (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings). doi: 10.1109/POLYTR.2007.4339147

Kawamoto, N. ; Murakami, Y. ; Shindo, D. et al. / Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder. 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. pp. 101-104 (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings).

@inproceedings{df0d38b682d5439081fce7e9951bbb29,

title = "Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder",

abstract = "Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.",

author = "N. Kawamoto and Y. Murakami and D. Shindo and K. Suganuma",

year = "2007",

month = dec,

day = "1",

doi = "10.1109/POLYTR.2007.4339147",

language = "English",

isbn = "1424411866",

series = "6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings",

pages = "101--104",

booktitle = "6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings",

note = "Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics ; Conference date: 15-01-2007 Through 18-01-2007",

}

TY - GEN

T1 - Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

AU - Kawamoto, N.

AU - Murakami, Y.

AU - Shindo, D.

AU - Suganuma, K.

PY - 2007/12/1

Y1 - 2007/12/1

N2 - Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

AB - Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

UR - http://www.scopus.com/inward/record.url?scp=49949103996&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=49949103996&partnerID=8YFLogxK

U2 - 10.1109/POLYTR.2007.4339147

DO - 10.1109/POLYTR.2007.4339147

M3 - Conference contribution

AN - SCOPUS:49949103996

SN - 1424411866

SN - 9781424411863

T3 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

SP - 101

EP - 104

BT - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

T2 - Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

Y2 - 15 January 2007 through 18 January 2007

ER -

Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

Abstract

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