Microstructure of bonding interface in explosively-welded clads and bonding mechanism

Akira Chiba, Minoru Nishida, Yasuhiro Morizono

Research output: Contribution to journalConference article

19 Citations (Scopus)

Abstract

Microstructural aspects and bonding characteristics of the explosive welded Ti/Ti, Ti/steel and Ti/Ni clads were investigated mainly by TEM microscopy. It was found that the bonding interface was composed of layers of metastable phases such as amorphous phases, icosahedral quasicrystal and intermetallic compounds. These metastable phases are formed as a trace of melting followed by subsequent rapid solidification of thin layers of about 200 nm in thickness along the contact surface of both the component materials. It is concluded that the very thin melting layer is responsible for the bonding of explosively welded Ti base clads and especially amorphous phase formed in the bonding interface keeps high bonding strength.

Original languageEnglish
Pages (from-to)465-474
Number of pages10
JournalMaterials Science Forum
Volume465-466
Publication statusPublished - Nov 25 2004
Externally publishedYes
EventProceedings of the 1st International Symposium on Explosion, Shock Wave and Hypervelocity Phenomena (ESHP Symposium) - Kumamoto, Japan
Duration: Mar 15 2004Mar 17 2004

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this