Microstructure of bonding interface in explosively-welded clads and bonding mechanism

Akira Chiba, Minoru Nishida, Yasuhiro Morizono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

Microstructural aspects and bonding characteristics of the explosive welded Ti/Ti, Ti/steel and Ti/Ni clads were investigated mainly by TEM microscopy. It was found that the bonding interface was composed of layers of metastable phases such as amorphous phases, icosahedral quasicrystal and intermetallic compounds. These metastable phases are formed as a trace of melting followed by subsequent rapid solidification of thin layers of about 200 nm in thickness along the contact surface of both the component materials. It is concluded that the very thin melting layer is responsible for the bonding of explosively welded Ti base clads and especially amorphous phase formed in the bonding interface keeps high bonding strength.

Original languageEnglish
Title of host publicationExplosion, Shock Wave and Hypervelocity Phenomena in Materials
EditorsShigeru Itoh, K. Hokamoto, Masahiro Fujita
PublisherTrans Tech Publications Ltd
Pages465-474
Number of pages10
ISBN (Print)9780878499502
DOIs
Publication statusPublished - Jan 1 2004
Externally publishedYes
EventProceedings of the 1st International Symposium on Explosion, Shock Wave and Hypervelocity Phenomena (ESHP Symposium) - Kumamoto, Japan
Duration: Mar 15 2004Mar 17 2004

Publication series

NameMaterials Science Forum
Volume465-466
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

OtherProceedings of the 1st International Symposium on Explosion, Shock Wave and Hypervelocity Phenomena (ESHP Symposium)
CountryJapan
CityKumamoto
Period3/15/043/17/04

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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