Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture

H. Yu; X. Ya; T. Tanaka; Kimihide Matsuyama

doi:10.1109/INTMAG.2015.7157552

Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture

H. Yu, X. Ya, T. Tanaka, Kimihide Matsuyama

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Current information devices will be confronted with a serious physical limit in the lateral downsizing in the future. An alternative approach for continuous progress in the device performance is intensively demanded. An integration of multi functionality, such as memory and logic components, is a promising solution for an increasing requirement in various system applications [1,2]. In the present study, an exchange coupled multilayer stack, was proposed as a quarterly state logic-in-memory structure, and fundamental device operations have been numerically demonstrated with micromagnetic simulations.

Original language	English
Title of host publication	2015 IEEE International Magnetics Conference, INTERMAG 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479973224
DOIs	https://doi.org/10.1109/INTMAG.2015.7157552
Publication status	Published - Jan 1 2015
Event	2015 IEEE International Magnetics Conference, INTERMAG 2015 - Beijing, China Duration: May 11 2015 → May 15 2015

Other

Other	2015 IEEE International Magnetics Conference, INTERMAG 2015
Country/Territory	China
City	Beijing
Period	5/11/15 → 5/15/15

All Science Journal Classification (ASJC) codes

Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/INTMAG.2015.7157552

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Yu, H, Ya, X , Tanaka, T & Matsuyama, K 2015, Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture. in 2015 IEEE International Magnetics Conference, INTERMAG 2015., 7157552, Institute of Electrical and Electronics Engineers Inc., 2015 IEEE International Magnetics Conference, INTERMAG 2015, Beijing, China, 5/11/15. https://doi.org/10.1109/INTMAG.2015.7157552

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M3 - Conference contribution

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Microwave assisted spin transfer torque switching in a vertically integrated logic-in-memory architecture

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