Fumed silica is widely used in SiO 2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, and used slurry is disposed. Sustainable development demands a reduction in waste. Since reuse of slurry is effective for reducing the amount of used slurry generated, we investigated the reuse of Mn 2O 3 slurry and conventional fumed silica slurry. In both cases, abrasive concentration decreases as reuse time increases. The removal rate for Mn 2O 3 slurry maintains a value 4 times that of the conventional fumed silica slurry during slurry reuse, because the removal rate for Mn 2O 3 slurry is almost constant for solid concentrations between 1.0 and 10 wt %. Pad conditioning was not performed for Mn 2O 3 slurry. The removal rate for conventional slurry decreases as the number of times of reuse increases, even when pad conditioning is appropriately performed.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)