Modeling and simulation of chemical amplification photoresist to produce high-density cone-shaped micro bumps

Daiki Kumagwa, Mamoru Sakamoto, Yohei Aoki, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The cone-shaped micro bump provides fine-pitch room-temperature flip-chip bonding technology. It has been demonstrated to be able to connect 15 ?m-pitch 640 x 512 array pixels of an image sensor composed of a compound semiconductor photodetector array and silicon readout integrated circuit. The cone-shaped microbump is fabricated by utilizing the characteristic of the chemical amplification photoresist. For further shrinkage of the interconnection pitch below 10 ?m, not only refining of process condition but also a new design of photoresist is required. In this work, we build a model and a simulation method to investigate how the property of the photoresist and process condition determine the final shape of the cone bump.

Original languageEnglish
Title of host publication2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages345-348
Number of pages4
ISBN (Electronic)9781538676684
DOIs
Publication statusPublished - Dec 2018
Event20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore
Duration: Dec 4 2018Dec 7 2018

Publication series

Name2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference20th IEEE Electronics Packaging Technology Conference, EPTC 2018
CountrySingapore
CitySingapore
Period12/4/1812/7/18

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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