To explain the difference between SiC-CVD on the Si-face and C-face, a heterogeneous model was improved, in which the etching, growth and doping features of SiC-CVD in a horizontal hot-wall reactor were numerically analyzed. The improved model was able to explain the etching and growth features accurately. There was no difference between the Si- and C-face. In addition, we propose the surface C/Si ratio as the universal parameter of the SiC-CVD process. Concerning doping features, the improved model showed that nitrogen and aluminum doping incorporation could be explained by the site competition model, while taking into account the amount of surface silicon and surface carbon, respectively.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry