Modeling on debonding dynamics of pressure-sensitive adhesives

T. Yamaguchi, H. Morita, M. Doi

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.

Original languageEnglish
Pages (from-to)7-17
Number of pages11
JournalEuropean Physical Journal E
Volume20
Issue number1
DOIs
Publication statusPublished - May 1 2006
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Biotechnology
  • Biophysics
  • Chemistry(all)
  • Materials Science(all)
  • Surfaces and Interfaces

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