Molecular dynamics and discrete element modeling studies of underfill

N. E. Iwamoto, M. Li, S. J. McCaffery, Masami Nakagawa, G. Mustoe

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

It is well known that capillary action drives the standard underfill phenonmenon. However, the underlying principles which govern the flow properties and specific formulation tradeoffs are in need of basic understanding. For instance, flow speed, filler settling, filler striation, and voiding are all properties that require a mechanistic understanding; and although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct how to control these effects. For the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been engaged to understand the formulation constituent effects. Both models similarly engage basic Newtonian dynamics to derive multi-body system simulations.

Original languageEnglish
Pages (from-to)322-328
Number of pages7
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume21
Issue number4
Publication statusPublished - Dec 1 1998
Externally publishedYes

Fingerprint

Molecular dynamics
Fillers
Molecular modeling
Interfacial energy
Binders
Engineers

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

Cite this

Molecular dynamics and discrete element modeling studies of underfill. / Iwamoto, N. E.; Li, M.; McCaffery, S. J.; Nakagawa, Masami; Mustoe, G.

In: International Journal of Microcircuits and Electronic Packaging, Vol. 21, No. 4, 01.12.1998, p. 322-328.

Research output: Contribution to journalArticle

Iwamoto, N. E. ; Li, M. ; McCaffery, S. J. ; Nakagawa, Masami ; Mustoe, G. / Molecular dynamics and discrete element modeling studies of underfill. In: International Journal of Microcircuits and Electronic Packaging. 1998 ; Vol. 21, No. 4. pp. 322-328.
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