Molecular dynamics study for low temperature brittleness in a tungsten single crystal

Hiroshi Noguchi, Yoshiyuki Furuya

Research output: Contribution to journalArticle

Abstract

A combined model of molecular dynamics with micromechanics was applied to simulations for low temperature brittleness in a tungsten single crystal. Temperature dependency of fracture toughness in low temperature was a main subject in this research. Fracture toughnesses at 77∼225 K were evaluated in simulations. Evaluated toughnesses showed clear temperature dependency, although there were differences between simulation results and experimental results. Two local stresses in nano-scale at a crack tip were introduced to explain a brittle fracture process. One was a driving force for slip and the other for cleavage. The driving force for cleavage was gradually increased after emissions of dislocations although driving force for slip was saturated, and cleavage was caused by the increased driving force when it reached a critical value. The critical values of the driving forces were not influenced by temperature. It meant that emissions of dislocations was not influenced by temperature but mobility of dislocations controlled the temperature dependency of fracture toughness.

Original languageEnglish
Pages (from-to)1620-1633
Number of pages14
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume66
Issue number648
Publication statusPublished - Dec 1 2000

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Tungsten
Brittleness
Molecular dynamics
Single crystals
Temperature
Fracture toughness
Micromechanics
Brittle fracture
Crack tips

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{92937511d99a4ab5bafc34f9ba4e6c1a,
title = "Molecular dynamics study for low temperature brittleness in a tungsten single crystal",
abstract = "A combined model of molecular dynamics with micromechanics was applied to simulations for low temperature brittleness in a tungsten single crystal. Temperature dependency of fracture toughness in low temperature was a main subject in this research. Fracture toughnesses at 77∼225 K were evaluated in simulations. Evaluated toughnesses showed clear temperature dependency, although there were differences between simulation results and experimental results. Two local stresses in nano-scale at a crack tip were introduced to explain a brittle fracture process. One was a driving force for slip and the other for cleavage. The driving force for cleavage was gradually increased after emissions of dislocations although driving force for slip was saturated, and cleavage was caused by the increased driving force when it reached a critical value. The critical values of the driving forces were not influenced by temperature. It meant that emissions of dislocations was not influenced by temperature but mobility of dislocations controlled the temperature dependency of fracture toughness.",
author = "Hiroshi Noguchi and Yoshiyuki Furuya",
year = "2000",
month = "12",
day = "1",
language = "English",
volume = "66",
pages = "1620--1633",
journal = "Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A",
issn = "0387-5008",
publisher = "一般社団法人日本機械学会",
number = "648",

}

TY - JOUR

T1 - Molecular dynamics study for low temperature brittleness in a tungsten single crystal

AU - Noguchi, Hiroshi

AU - Furuya, Yoshiyuki

PY - 2000/12/1

Y1 - 2000/12/1

N2 - A combined model of molecular dynamics with micromechanics was applied to simulations for low temperature brittleness in a tungsten single crystal. Temperature dependency of fracture toughness in low temperature was a main subject in this research. Fracture toughnesses at 77∼225 K were evaluated in simulations. Evaluated toughnesses showed clear temperature dependency, although there were differences between simulation results and experimental results. Two local stresses in nano-scale at a crack tip were introduced to explain a brittle fracture process. One was a driving force for slip and the other for cleavage. The driving force for cleavage was gradually increased after emissions of dislocations although driving force for slip was saturated, and cleavage was caused by the increased driving force when it reached a critical value. The critical values of the driving forces were not influenced by temperature. It meant that emissions of dislocations was not influenced by temperature but mobility of dislocations controlled the temperature dependency of fracture toughness.

AB - A combined model of molecular dynamics with micromechanics was applied to simulations for low temperature brittleness in a tungsten single crystal. Temperature dependency of fracture toughness in low temperature was a main subject in this research. Fracture toughnesses at 77∼225 K were evaluated in simulations. Evaluated toughnesses showed clear temperature dependency, although there were differences between simulation results and experimental results. Two local stresses in nano-scale at a crack tip were introduced to explain a brittle fracture process. One was a driving force for slip and the other for cleavage. The driving force for cleavage was gradually increased after emissions of dislocations although driving force for slip was saturated, and cleavage was caused by the increased driving force when it reached a critical value. The critical values of the driving forces were not influenced by temperature. It meant that emissions of dislocations was not influenced by temperature but mobility of dislocations controlled the temperature dependency of fracture toughness.

UR - http://www.scopus.com/inward/record.url?scp=71249097797&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=71249097797&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:71249097797

VL - 66

SP - 1620

EP - 1633

JO - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

JF - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

SN - 0387-5008

IS - 648

ER -