Abstract
Vacuum-assisted resin transfer molding (VARTM) is a manufacturing process that is used to make large and complex composite structures. While promising, VARTM still suffers from relatively low fiber volume fractions and high void content in the final products. The infusion step of VARTM is very important, because the quality of the final product is usually decided by this process. Consequently, a comprehensive understanding of the infusion process is essential. In this study, a three-dimensional digital image correlation (3D-DIC) testing system was set up to research the entire infusion process through the monitor of the thickness change of the laminates in this process. Two distinct VARTM processes, with and without a rigid cover mold, were designed to be studied. The 3D-DIC technique proved to be a valid method that not only can monitor the thickness evolution of isolated points but also can give a full-field distribution of the thickness change of the laminate. The results showed that, without the use of a rigid cover mold, the stack of reinforcements initially shrank and then expanded as the resin filled the cavities before closing the inlet, while when using a rigid cover mold there was an additional expansion period before the shrinkage occurred. Such an expansion stage could promote the flow of the resin, shortening the infusion time.
Original language | English |
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Title of host publication | International Conference on Experimental Mechanics 2013 and Twelfth Asian Conference on Experimental Mechanics |
Publisher | SPIE |
ISBN (Print) | 9781628412888 |
DOIs | |
Publication status | Published - Jan 1 2014 |
Event | International Conference on Experimental Mechanics 2013, ICEM 2013 and the 12th Asian Conference on Experimental Mechanics, ACEM 2013 - Bangkok, Thailand Duration: Nov 25 2013 → Nov 27 2013 |
Publication series
Name | Proceedings of SPIE - The International Society for Optical Engineering |
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Volume | 9234 |
ISSN (Print) | 0277-786X |
ISSN (Electronic) | 1996-756X |
Other
Other | International Conference on Experimental Mechanics 2013, ICEM 2013 and the 12th Asian Conference on Experimental Mechanics, ACEM 2013 |
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Country | Thailand |
City | Bangkok |
Period | 11/25/13 → 11/27/13 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Cite this
Monitoring of resin transfer in CFRP molding using 3D-DIC technique. / Chen, Dingding; Arakawa, Kazuo; Uchino, Masakazu.
International Conference on Experimental Mechanics 2013 and Twelfth Asian Conference on Experimental Mechanics. SPIE, 2014. 923405 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 9234).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Monitoring of resin transfer in CFRP molding using 3D-DIC technique
AU - Chen, Dingding
AU - Arakawa, Kazuo
AU - Uchino, Masakazu
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Vacuum-assisted resin transfer molding (VARTM) is a manufacturing process that is used to make large and complex composite structures. While promising, VARTM still suffers from relatively low fiber volume fractions and high void content in the final products. The infusion step of VARTM is very important, because the quality of the final product is usually decided by this process. Consequently, a comprehensive understanding of the infusion process is essential. In this study, a three-dimensional digital image correlation (3D-DIC) testing system was set up to research the entire infusion process through the monitor of the thickness change of the laminates in this process. Two distinct VARTM processes, with and without a rigid cover mold, were designed to be studied. The 3D-DIC technique proved to be a valid method that not only can monitor the thickness evolution of isolated points but also can give a full-field distribution of the thickness change of the laminate. The results showed that, without the use of a rigid cover mold, the stack of reinforcements initially shrank and then expanded as the resin filled the cavities before closing the inlet, while when using a rigid cover mold there was an additional expansion period before the shrinkage occurred. Such an expansion stage could promote the flow of the resin, shortening the infusion time.
AB - Vacuum-assisted resin transfer molding (VARTM) is a manufacturing process that is used to make large and complex composite structures. While promising, VARTM still suffers from relatively low fiber volume fractions and high void content in the final products. The infusion step of VARTM is very important, because the quality of the final product is usually decided by this process. Consequently, a comprehensive understanding of the infusion process is essential. In this study, a three-dimensional digital image correlation (3D-DIC) testing system was set up to research the entire infusion process through the monitor of the thickness change of the laminates in this process. Two distinct VARTM processes, with and without a rigid cover mold, were designed to be studied. The 3D-DIC technique proved to be a valid method that not only can monitor the thickness evolution of isolated points but also can give a full-field distribution of the thickness change of the laminate. The results showed that, without the use of a rigid cover mold, the stack of reinforcements initially shrank and then expanded as the resin filled the cavities before closing the inlet, while when using a rigid cover mold there was an additional expansion period before the shrinkage occurred. Such an expansion stage could promote the flow of the resin, shortening the infusion time.
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UR - http://www.scopus.com/inward/citedby.url?scp=84902792016&partnerID=8YFLogxK
U2 - 10.1117/12.2051136
DO - 10.1117/12.2051136
M3 - Conference contribution
AN - SCOPUS:84902792016
SN - 9781628412888
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - International Conference on Experimental Mechanics 2013 and Twelfth Asian Conference on Experimental Mechanics
PB - SPIE
ER -