The present work attempted to describe the tensile stress-strain behavior of the Bi2223 filaments in the composite tape and its influence on critical current by means of a Monte Carlo-shear lag simulation method, in which the distribution of strength within the filament was given by a Monte Carlo method and the stress distribution in the filament was calculated with a shear-lag analysis. With this approach, (a) the stress-strain curve of the Bi2223 filament in the composite tape measured by X-ray method, (b) the observed fracture morphology of the filament in which transverse (perpendicular to tensile axis) and longitudinal (parallel to tensile axis) fractures take place consecutively, and (c) the measured change of critical current with increasing applied tensile strain, could be described fairly well.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering