TY - GEN
T1 - Multi-Channel Near-Infrared Bandpass Mosaic Filter for Spectral Fundus Imaging
AU - Tang, Honghao
AU - Takehara, Hironari
AU - Horiki, Yusuke
AU - Haruta, Makito
AU - Sasagawa, Kiyotaka
AU - Ohta, Jun
AU - Tashiro, Hiroyuki
N1 - Funding Information:
This work was supported by the Japan Science and Technology Agency, ACCEL (JPMJAC1601); the VLSI Design and Education Center (VDEC); and the University of Tokyo in collaboration with Cadence Corporation and Mentor Graphics Corporation.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - We previously reported a near-infrared (NIR) color fundus camera that can image the fundus without the use of mydriatic agents. Using this technology, pseudo-color images can be reconstructed from images in the three NIR wavelength bands. In this study, we designed and manufactured a five-wavelength bandpass mosaic filter for CMOS image sensors (CIS) by modifying the thickness of the middle layer of a multilayer thin-film structure based on the interference bandpass filter principle. It is possible to acquire information about all bands at all locations on the fundus by using the fixational movement of the human eye. Adapting a fabricated 5-channel CIS, we report the validity of high-spatial-resolution imaging by demosaicing and spectral resolution enhancement by deconvolution processing.
AB - We previously reported a near-infrared (NIR) color fundus camera that can image the fundus without the use of mydriatic agents. Using this technology, pseudo-color images can be reconstructed from images in the three NIR wavelength bands. In this study, we designed and manufactured a five-wavelength bandpass mosaic filter for CMOS image sensors (CIS) by modifying the thickness of the middle layer of a multilayer thin-film structure based on the interference bandpass filter principle. It is possible to acquire information about all bands at all locations on the fundus by using the fixational movement of the human eye. Adapting a fabricated 5-channel CIS, we report the validity of high-spatial-resolution imaging by demosaicing and spectral resolution enhancement by deconvolution processing.
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U2 - 10.1109/IMFEDK56875.2022.9975371
DO - 10.1109/IMFEDK56875.2022.9975371
M3 - Conference contribution
AN - SCOPUS:85145668400
T3 - 2022 IEEE International Meeting for Future of Electron Devices, Kansai, IMFEDK 2022
BT - 2022 IEEE International Meeting for Future of Electron Devices, Kansai, IMFEDK 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE International Meeting for Future of Electron Devices, Kansai, IMFEDK 2022
Y2 - 28 November 2022 through 30 November 2022
ER -