Nanoindentation characterization of intermetallic compounds formed between Sn-Cu (-Ni) ball grid arrays and Cu substrates

Hideaki Tsukamoto, Zhigang Dong, Han Huang, Tetsuro Nishimura, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

38 Citations (Scopus)

Abstract

The formation of intermetallic compounds (IMCs) at the solder-substrate interface is essential in the manufacturing of solder joints. In this study, the effect of Ni addition into Sn-Cu lead-free solders on mechanical properties of the IMCs formed at the interface between solder ball grid arrays (BGAs) and Cu substrates, which experienced multiple reflows, were investigated. The results from nanoindentation tests showed that elastic modulus and hardness of (Cu,Ni)6Sn5 were higher than those of Cu6Sn5. The hardnesses of (Cu,Ni)6Sn5 were more scattered compared to those of Cu6Sn5, which may be attributed to the crystallographic characteristics such as growth texture of the IMCs.

Original languageEnglish
Pages (from-to)44-50
Number of pages7
JournalMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Volume164
Issue number1
DOIs
Publication statusPublished - Aug 15 2009

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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