Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface

Hideaki Tsukamoto, Zigang Dong, Han Huang, Tetsuro Nishimura, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn 5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062×10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.

Original languageEnglish
Title of host publicationPRICM7
Pages2446-2449
Number of pages4
DOIs
Publication statusPublished - Aug 17 2010
Event7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia
Duration: Aug 2 2010Aug 6 2010

Publication series

NameMaterials Science Forum
Volume654-656
ISSN (Print)0255-5476

Other

Other7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
CountryAustralia
CityCairns, QLD
Period8/2/108/6/10

Fingerprint

Nanoindentation
solders
nanoindentation
Soldering alloys
Intermetallics
intermetallics
strain rate
Strain rate
Substrates
Chemical activation
activation
Ball grid arrays
Structural integrity
integrity
balls
grids
mechanical properties
Mechanical properties
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Tsukamoto, H., Dong, Z., Huang, H., Nishimura, T., & Nogita, K. (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. In PRICM7 (pp. 2446-2449). (Materials Science Forum; Vol. 654-656). https://doi.org/10.4028/www.scientific.net/MSF.654-656.2446

Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. / Tsukamoto, Hideaki; Dong, Zigang; Huang, Han; Nishimura, Tetsuro; Nogita, Kazuhiro.

PRICM7. 2010. p. 2446-2449 (Materials Science Forum; Vol. 654-656).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tsukamoto, H, Dong, Z, Huang, H, Nishimura, T & Nogita, K 2010, Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. in PRICM7. Materials Science Forum, vol. 654-656, pp. 2446-2449, 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 8/2/10. https://doi.org/10.4028/www.scientific.net/MSF.654-656.2446
Tsukamoto H, Dong Z, Huang H, Nishimura T, Nogita K. Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. In PRICM7. 2010. p. 2446-2449. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.654-656.2446
Tsukamoto, Hideaki ; Dong, Zigang ; Huang, Han ; Nishimura, Tetsuro ; Nogita, Kazuhiro. / Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. PRICM7. 2010. pp. 2446-2449 (Materials Science Forum).
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abstract = "The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn 5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062×10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.",
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