Nanoscale characterization of epoxy interface on silica

Kenji Okamoto, Tatsuya Ganbe, Nobuyuki Sekine, Mika Aoki, Manabu Inutsuka, Atsuomi Shundo, Daisuke Kawaguchi, Keiji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The objective of this study is to carry out nanoscale characterization of the epoxy resin interface on silica by determining the glass-transition temperature (Tg) and molecular conformation at the interface by means of a novel non-destructive method. The Tg was determined by fluorescence lifetime measurements using evanescent wave excitation. It was revealed that the Tg of epoxy resin at a distance of 30 nm from the interface was 10 K higher than that at a distance of 80 nm. The chemical composition and molecular conformation were analysed by X-ray photoelectron spectroscopy and sum-frequency generation (SFG) spectroscopy, respectively. The SFG data revealed that unreacted epoxy group remained at the interface. The Tg of epoxy resin increased in the regions near the interface, and the epoxy group remained unreacted at a distance of ca. 10 nm or less from the interface.

Original languageEnglish
Title of host publicationProceedings of the 2016 IEEE International Conference on Dielectrics, ICD 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages84-87
Number of pages4
Volume1
ISBN (Electronic)9781509028023
DOIs
Publication statusPublished - Aug 18 2016
Event1st IEEE International Conference on Dielectrics, ICD 2016 - Montpellier, France
Duration: Jul 3 2016Jul 7 2016

Other

Other1st IEEE International Conference on Dielectrics, ICD 2016
CountryFrance
CityMontpellier
Period7/3/167/7/16

All Science Journal Classification (ASJC) codes

  • Polymers and Plastics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Ceramics and Composites

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