Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

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8 Citations (Scopus)

Abstract

Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic devices. To achieve the desired properties, it is necessary to obtain a better understanding of how the network formation and physical state change involved in the curing reaction affect the resultant network architecture and physical properties. However, this is not necessarily easy because of their infusibility at higher temperatures and insolubility in organic solvents. In this paper, we summarize the knowledge related to these issues which has been gathered using various experimental techniques in conjunction with molecular dynamics simulations. This should provide useful ideas for researchers who aim to design and construct various thermosetting polymer systems including currently popular materials such as vitrimers over epoxy resins.

Original languageEnglish
Pages (from-to)1522-1542
Number of pages21
JournalJournal of the American Chemical Society
Volume2
Issue number7
DOIs
Publication statusPublished - Jul 25 2022

All Science Journal Classification (ASJC) codes

  • Catalysis
  • Chemistry(all)
  • Biochemistry
  • Colloid and Surface Chemistry

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