New approaches to joining ceramics for high-temperature applications

M. R. Locatelli, B. J. Dalgleish, K. Nakashima, A. P. Tomsia, A. M. Glaeser

Research output: Contribution to journalArticlepeer-review

79 Citations (Scopus)

Abstract

Micro-designed multilayer interlayers have been used to join both oxide and non-oxide ceramics. The approach allows the formation of ceramic-ceramic joints with high melting point metals at temperatures that are typically several hundred degrees lower than those required for more conventional joining methods. The new joining approach employs a thin transient liquid phase (TLP) layer to allow joining by a brazing-like process. Several distinct interlayers have been used to join alumina ceramics successfully; work using Ni-based interlayers has demonstrated the potentially beneficial impact of "reactive" metal additions to the TLP. The method has also been applied to the joining of silicon-based ceramics, and has led to the fabrication of joints with reproducibly high strengths.

Original languageEnglish
Pages (from-to)313-322
Number of pages10
JournalCeramics International
Volume23
Issue number4
DOIs
Publication statusPublished - Jan 1 1997
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Materials Chemistry

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