New model of defect formation caused by retainer ring in chemical mechanical polishing

Akira Isobe, Takashi Komiyama, Syuhei Kurokawa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Defect formation by retainer ring pressure in chemical mechanical polishing (CMP) was investigated. It was found that a higher retainer ring pressure causes more defects. The mechanism underlying this finding was considered to be the agglomeration of abrasive particles mixed with polished polymers from the retainer ring. Such agglomeration is accelerated by increasing the retainer ring pressure. This ring pressure exerts stress onto particles and also polishes the polymers from the ring. Lowering the retainer ring pressure and also changing the ring material from polymers, which are easy to polish, to tough materials are effective for minimizing the density of defects in CMP.

Original languageEnglish
Article number126502
JournalJapanese Journal of Applied Physics
Volume52
Issue number12
DOIs
Publication statusPublished - Dec 2013

Fingerprint

Chemical mechanical polishing
polishing
Defects
rings
defects
Polymers
Agglomeration
agglomeration
polymers
Abrasives
abrasives
causes

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

New model of defect formation caused by retainer ring in chemical mechanical polishing. / Isobe, Akira; Komiyama, Takashi; Kurokawa, Syuhei.

In: Japanese Journal of Applied Physics, Vol. 52, No. 12, 126502, 12.2013.

Research output: Contribution to journalArticle

@article{6caeadcbc69545bd8259c588a2f1650f,
title = "New model of defect formation caused by retainer ring in chemical mechanical polishing",
abstract = "Defect formation by retainer ring pressure in chemical mechanical polishing (CMP) was investigated. It was found that a higher retainer ring pressure causes more defects. The mechanism underlying this finding was considered to be the agglomeration of abrasive particles mixed with polished polymers from the retainer ring. Such agglomeration is accelerated by increasing the retainer ring pressure. This ring pressure exerts stress onto particles and also polishes the polymers from the ring. Lowering the retainer ring pressure and also changing the ring material from polymers, which are easy to polish, to tough materials are effective for minimizing the density of defects in CMP.",
author = "Akira Isobe and Takashi Komiyama and Syuhei Kurokawa",
year = "2013",
month = "12",
doi = "10.7567/JJAP.52.126502",
language = "English",
volume = "52",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Institute of Physics",
number = "12",

}

TY - JOUR

T1 - New model of defect formation caused by retainer ring in chemical mechanical polishing

AU - Isobe, Akira

AU - Komiyama, Takashi

AU - Kurokawa, Syuhei

PY - 2013/12

Y1 - 2013/12

N2 - Defect formation by retainer ring pressure in chemical mechanical polishing (CMP) was investigated. It was found that a higher retainer ring pressure causes more defects. The mechanism underlying this finding was considered to be the agglomeration of abrasive particles mixed with polished polymers from the retainer ring. Such agglomeration is accelerated by increasing the retainer ring pressure. This ring pressure exerts stress onto particles and also polishes the polymers from the ring. Lowering the retainer ring pressure and also changing the ring material from polymers, which are easy to polish, to tough materials are effective for minimizing the density of defects in CMP.

AB - Defect formation by retainer ring pressure in chemical mechanical polishing (CMP) was investigated. It was found that a higher retainer ring pressure causes more defects. The mechanism underlying this finding was considered to be the agglomeration of abrasive particles mixed with polished polymers from the retainer ring. Such agglomeration is accelerated by increasing the retainer ring pressure. This ring pressure exerts stress onto particles and also polishes the polymers from the ring. Lowering the retainer ring pressure and also changing the ring material from polymers, which are easy to polish, to tough materials are effective for minimizing the density of defects in CMP.

UR - http://www.scopus.com/inward/record.url?scp=84892391433&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84892391433&partnerID=8YFLogxK

U2 - 10.7567/JJAP.52.126502

DO - 10.7567/JJAP.52.126502

M3 - Article

VL - 52

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 12

M1 - 126502

ER -