New model of defect formation caused by retainer ring in chemical mechanical polishing

Akira Isobe, Takashi Komiyama, Syuhei Kurokawa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Defect formation by retainer ring pressure in chemical mechanical polishing (CMP) was investigated. It was found that a higher retainer ring pressure causes more defects. The mechanism underlying this finding was considered to be the agglomeration of abrasive particles mixed with polished polymers from the retainer ring. Such agglomeration is accelerated by increasing the retainer ring pressure. This ring pressure exerts stress onto particles and also polishes the polymers from the ring. Lowering the retainer ring pressure and also changing the ring material from polymers, which are easy to polish, to tough materials are effective for minimizing the density of defects in CMP.

Original languageEnglish
Article number126502
JournalJapanese journal of applied physics
Volume52
Issue number12
DOIs
Publication statusPublished - Dec 1 2013

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'New model of defect formation caused by retainer ring in chemical mechanical polishing'. Together they form a unique fingerprint.

  • Cite this