New module structure using flip-chip technology for high-speed optical communication ICs

Satoshi Yamaguchi; Yuhki Imai; Shunji Kimura; Hideki Tsunetsugu

New module structure using flip-chip technology for high-speed optical communication ICs

Satoshi Yamaguchi, Yuhki Imai, Shunji Kimura, Hideki Tsunetsugu

Research output: Contribution to journal › Conference article › peer-review

Abstract

This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

Original language	English
Pages (from-to)	243-246
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	1
Publication status	Published - Jan 1 1996
Externally published	Yes
Event	Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA Duration: Jun 17 1996 → Jun 21 1996

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "New module structure using flip-chip technology for high-speed optical communication ICs",

abstract = "This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.",

author = "Satoshi Yamaguchi and Yuhki Imai and Shunji Kimura and Hideki Tsunetsugu",

year = "1996",

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language = "English",

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note = "Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) ; Conference date: 17-06-1996 Through 21-06-1996",

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AU - Yamaguchi, Satoshi

AU - Imai, Yuhki

AU - Kimura, Shunji

AU - Tsunetsugu, Hideki

PY - 1996/1/1

Y1 - 1996/1/1

N2 - This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

AB - This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

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M3 - Conference article

AN - SCOPUS:0029700787

VL - 1

SP - 243

EP - 246

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

SN - 0149-645X

T2 - Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3)

Y2 - 17 June 1996 through 21 June 1996

ER -

New module structure using flip-chip technology for high-speed optical communication ICs

Abstract

All Science Journal Classification (ASJC) codes

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