New module structure using flip-chip technology for high-speed optical communication ICs

Satoshi Yamaguchi, Yuhki Imai, Shunji Kimura, Hideki Tsunetsugu

Research output: Contribution to journalConference article

24 Citations (Scopus)


This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

Original languageEnglish
Pages (from-to)243-246
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Publication statusPublished - Jan 1 1996
Externally publishedYes
EventProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
Duration: Jun 17 1996Jun 21 1996


All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this