New Positive EB Resist with Strong Resistance to Plasma Damage

Kazuo Yamaguchi, Hiroyuki Ozaki, Akira Hirao, Nobumitsu Hirose, Yuuichi Harada, Yoshinori Uzawa, Matsuo Sekine, Shigeru Yoshimori, Mitsuo Kawamura

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Copolymers of methyl methacrylate (MMA) and 3–triethoxysilylpropyl methacrylate (ESPMA) were synthesized and employed as an electron beam (EB) resist. The copolymer with a content of 10 mol% ESPMA worked as a positive EB resist and had 4–10 times as strong a resistance as poly(methylmethacrylate) (PMMA) to CBrF3 plasma etching. The resolution and sensitivity were almost the same as those of PMMA. From experimental results concerning the insolubility of the plasma–irradiated copolymer and measurement of IR spectra, the enhanced resistance to plasma etching appears to be caused by formation of a cross–linking structure based on the Si–O–Si linkage.

Original languageEnglish
Pages (from-to)L33-L34
JournalJournal of the Electrochemical Society
Volume139
Issue number3
DOIs
Publication statusPublished - Mar 1992
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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    Yamaguchi, K., Ozaki, H., Hirao, A., Hirose, N., Harada, Y., Uzawa, Y., Sekine, M., Yoshimori, S., & Kawamura, M. (1992). New Positive EB Resist with Strong Resistance to Plasma Damage. Journal of the Electrochemical Society, 139(3), L33-L34. https://doi.org/10.1149/1.2069330