New Thermal Management Systems for Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Shinmoto Yasuhisa, Masahide Sato, Ken ichi Iimura

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44-53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42-50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.

Original languageEnglish
Article number031005
JournalJournal of Thermal Science and Engineering Applications
Volume4
Issue number3
DOIs
Publication statusPublished - Jul 16 2012

Fingerprint

management systems
Temperature control
cooling systems
heat pipes
Cooling
cooling
Cooling systems
heat exchangers
Heat pipes
Heat exchangers
Servers
rooms
racks
air cooling
jackets
liquid cooling
Information technology
energy consumption
heat
Program processors

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Engineering(all)
  • Fluid Flow and Transfer Processes

Cite this

Ouchi, M., Abe, Y., Fukagaya, M., Kitagawa, T., Ohta, H., Yasuhisa, S., ... Iimura, K. I. (2012). New Thermal Management Systems for Data Centers. Journal of Thermal Science and Engineering Applications, 4(3), [031005]. https://doi.org/10.1115/1.4006478

New Thermal Management Systems for Data Centers. / Ouchi, Mayumi; Abe, Yoshiyuki; Fukagaya, Masato; Kitagawa, Takashi; Ohta, Haruhiko; Yasuhisa, Shinmoto; Sato, Masahide; Iimura, Ken ichi.

In: Journal of Thermal Science and Engineering Applications, Vol. 4, No. 3, 031005, 16.07.2012.

Research output: Contribution to journalArticle

Ouchi, M, Abe, Y, Fukagaya, M, Kitagawa, T, Ohta, H, Yasuhisa, S, Sato, M & Iimura, KI 2012, 'New Thermal Management Systems for Data Centers', Journal of Thermal Science and Engineering Applications, vol. 4, no. 3, 031005. https://doi.org/10.1115/1.4006478
Ouchi, Mayumi ; Abe, Yoshiyuki ; Fukagaya, Masato ; Kitagawa, Takashi ; Ohta, Haruhiko ; Yasuhisa, Shinmoto ; Sato, Masahide ; Iimura, Ken ichi. / New Thermal Management Systems for Data Centers. In: Journal of Thermal Science and Engineering Applications. 2012 ; Vol. 4, No. 3.
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